1. Unique heat dissipation technology

(1) Heat dissipation The heat transfer of the high-power device is realized by the heat pipe with the isothermal effect as the core heat conduction component, and then the heat dissipation is forced by the heat sink to coordinate the heat dissipation. Compared with other passive fins, the high-efficiency heat pipe radiator has an active heat dissipation method with a large heat transfer power and a high heat flow density that fully satisfies high power, and can achieve high power at rated power. Time runs.

2, heat pipe

 After the chip is packaged, the heat can be effectively exported, but the heat cannot be effectively dissipated without the system-level heat dissipation design. Theoretical analysis and experiments prove that the heat pipe cooling technology is very suitable for providing high-power system professional heat dissipation.

Heat pipe heat dissipation begins with spacecraft applications and has been widely used in electronics, metallurgy, chemistry, power, machinery and many other fields. It is a very mature and reliable technology. One of the most familiar is the application of heat pipes in the notebook computer.

Heat pipe conduction (scatter) heat principle

A typical heat pipe is composed of a casing, a wick, and an end cap. One end of the tube is an evaporation section (heating section), and the other end is a condensation section (cooling section). When one end of the heat pipe is heated, the liquid in the capillary core evaporates and vaporizes, and the steam flows to the other end under a slight pressure difference to release heat to condense into a liquid, and the liquid flows back to the evaporation section along the porous material by capillary action. This cycle is so long that heat is transferred from one end of the heat pipe to the other.

Application of heat pipe on high power lamps

From the introduction of the heat pipe principle, the basic form of heat dissipation of the heat pipe on the high-power lamp can be known, that is, the evaporation section of the heat pipe is connected to the base, and the condensation section is connected with the heat radiating fin. Through the heat pipe, the heat on the chip is continuously transmitted to the heat sink to dissipate.

Heat pipe heat transfer efficienc

At present, the heat pipe applied to the luminaire is a Φ 6 copper tube. Its theoretical value of thermal conductivity is 25-30W for a single heat pipe, which is basically equivalent to the total amount of heat generated by 30-40 1W chips. In practical applications, the heat dissipation performance of the combination of the heat pipe and the heat dissipating fins is matched with the total heat generation of the chip used.

3, phase change heat sink

 Tests have shown that the chip has a thermal resistance using a conventional aluminum or copper heat sink (base), and the temperature difference between the two ends is large when transferring heat generated by a high-power chip. (The temperature difference between the 2W chip and the heat sink is more than 6~8°C. When the 5W chip is working, the temperature difference of the heat sink is more than 10°C. When the package chip reaches 20W, the temperature difference will exceed 20°C.) This is extremely unfavorable for the chip heat dissipation. In order to reduce this temperature difference, a high-power dedicated micro-scale phase change heat sink (base) has been specially developed. The isothermal effect of the heat sink can cause the heat source from the high-power chip to be continuously transmitted.