Selecting the IGBT module heat sink is first and foremost a prerequisite from two factors:

1. Thermal resistance, thermal resistance is an important indicator to measure the heat dissipation capacity of the heat sink. The focus of thermal design is to calculate the thermal resistance of the heat sink. When selecting, first determine the cooling method according to the power consumption of the original device. Range can refer to the following figure to select high power heat pipe radiator

2. Cooling method, cooling can ensure the stability of thermal resistance, choose which method is more suitable, structure, reliable operation, cost are the key points of consideration, each method has advantages and disadvantages, the following figure is based on power consumption as a parameter , the scope of the determination can be referenced to choose

Characteristics of IGBT module air-cooled radiator

The air-cooled radiator is characterized by high heat dissipation efficiency, low cost, high reliability, simple structure and convenient maintenance. The traditional air-cooled type has been subject to the level of the process, mold and processing capability of the radiator, so that the heat dissipation capability is not sufficient. The development of its application is only applicable to the case where the heat dissipation power is small and the heat dissipation space is large. Even so, the use of air-cooled heat sinks in power electronics is quite widespread and widespread.

With the rapid development of power electronics technology and the increasing demand for high performance, high reliability and high power components of electronic devices, the heat dissipation per unit volume is getting higher and higher, resulting in a sharp rise in heat generation and temperature. . Due to the fact that mechanical, chemical and electrical problems are becoming more and more serious due to thermal drive, which seriously restricts the quality and reliability of products, the heat dissipation problem of high-power components (IGBT modules) has become a concern in current power electronics applications. Hot spot.

Thermal solution for high-power electronic devices (IGBT module heat sinks)

In the thermal design of electronic components, the choice of heat dissipation method, as well as testing, simulating, analyzing and optimizing it to obtain a structure with high thermal efficiency and low cost, the internal junction temperature of the power device is always kept within the allowable range when the power device is operated. It is especially important within.

The high-power radiator, the environment in which the air is cooled, and the temperature change state on the electronic original device are different everywhere, the air inlet side has a relatively low temperature, the wind speed is high, the wind side temperature is high, and the wind speed is low. For the two electronic original devices on the same substrate, the temperature on the wind side is higher.